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Welcome to the Electrical Interconnect & Packaging (EIP) Lab!

Designcon2014.jpg Laketahoe2014.jpg

EIP Lab attened DesignCon2014 in San Francisco and had a winter workshop at Lake Tahoe.

Notice

  • 전자파학회지 “60 GHz 대역 신호 무결성을 위한 플립 칩 구조 최적화” 논문의 raw data 입니다. click!
  • 대학원생 및 학부인턴을 모집합니다. click!