Difference between revisions of "Professor"

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*Guest Editor, IEEE T-CPMT, Special Issue on Through-Silicon Via (published in Feb. 2011)
 
*Guest Editor, IEEE T-CPMT, Special Issue on Through-Silicon Via (published in Feb. 2011)
 
*Technical Program Committee, ISQED (2007~2012)
 
*Technical Program Committee, ISQED (2007~2012)
 
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*Chief Organizing Chair, EDAPS 2015 (senior member)
 
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*한국전자파학회 패키지 연구회 위원장
/*==Professional Activities==
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/*Senior Member, IEEE
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/*Associate Editor, IEEE Trans. Components, Packaging, and Manufacturing Technology (2010~Present)
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/*Guest Editor, IEEE T-CPMT, Special Issue on Through-Silicon Via (published in Feb. 2011)
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/*Technical Program Committee, ISQED (2007~2012)
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/*==Publications==
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/*[[publications|click]]
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Revision as of 08:30, 26 February 2014


Professor.jpg Prof.Dong Gun Kam(감동근)
tel) +82-31-219-3534
Office) Rm 304, Bldg, Woncheon

Ajou University

206 World Cup-ro, Yeongtong-gu,

Suwon, 443-749, S.Korea

Email) kam@ajou.ac.kr

Education

  • 2002.3 ~ 2006.8 : Ph.D. in Electrical Engineering, KAIST, Daejeon, Korea (Advisor: Prof. Joungho Kim)
  • 2000.3 ~ 2002.2 : M.S. in Electrical Engineering, KAIST, Daejeon, Korea
  • 1995.3 ~ 2000.2 : B.S. in Physics, KAIST, Daejeon, Korea (Double Major in Electrical Engineering)

Research Experience

  • 2011.9 ~ Present : Assistant Professor, Ajou University, Suwon, Korea
  • 2008.8 ~ 2011.7 : Research Staff Member, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
  • 2007.5 ~ 2008.8 : Postdoctoral Researcher, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA
  • 2006.10 ~ 2007.5 : Member of Technical Staff, Silicon Image, Inc., Sunnyvale, CA, USA

Awards & Honors

  • IEEE CPMT Society, Outstanding Young Engineer Award (2013)
  • IBM Research, Pat Goldberg Memorial Best Paper Award (2011)
  • IBM, 1st Plateau Invention Achievement Award (2011)
  • IEC, DesignCon Paper Award (2008)
  • Motorola/IEEE CPMT Society, Graduate Fellowship (2002)
  • KAIST, Dean’s Award (1995)
  • Gyeongnam Science High School, Valedictorian (1995)

Professional Activities

  • Senior Member, IEEE
  • Associate Editor, IEEE Trans. Components, Packaging, and Manufacturing Technology (2010~Present)
  • Guest Editor, IEEE T-CPMT, Special Issue on Through-Silicon Via (published in Feb. 2011)
  • Technical Program Committee, ISQED (2007~2012)
  • Chief Organizing Chair, EDAPS 2015 (senior member)
  • 한국전자파학회 패키지 연구회 위원장