Difference between revisions of "Publications"

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*"Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets"
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=='''JOURNALS'''==
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::by D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd
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# Sangwook Park, Miroslav Kotzev, Heinz-D. Brüns, Dong Gun Kam, and Christian Schuster, “Lessons from Applying IEEE Standard 1597 for Validation of Computational Electromagnetics Computer Modeling and Simulations,”
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::IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814
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#:IEEE Electromagnetic Compatibility Magazine, vol. 6, Q. 2, Aug. 2017, pp. 55-67.
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*"Foreword: special section on through silicon vias"
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# H. Seo, W. Hong, and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
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::by D. Kam and J. Kim
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#:Microwave and Optical Technology Letters, vol. 58, no. 4, Apr. 2016, pp. 745-747.
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::IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153
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# M. Kwon and D. Kam, “Removal of specific harmonic by edge rate control for RFI mitigation,”
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*"A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications"
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#:IEEE Trans. Electromagnetic Compatibility, vol. 57, no. 5, Oct. 2015, pp. 1274-1276.
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::by A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd
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# M. Kim and D. Kam, “Wideband and compact EBG structure with balanced slots,”
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::IEEE J. Solid-State Circuits, Vol. 46, No. 5, May 2011, pp. 1059-1075
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 5, no. 6, June 2015, pp. 818-827.
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*"Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited)"
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# C. Hwang, W. Park, and D. Kam, “Complex permittivity extraction from PCB stripline measurement using recessed probe launch,”
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::by A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd
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#:IEICE Electronics Express, vol. 12, no. 5, Mar. 2015, pp. 1-8.
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::IEEE Communications Magazine, Vol. 49, No. 4, Apr. 2011, pp. 120-131
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# S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,”
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*"LTCC packages with embedded phased-array antennas for 60-GHz communications"
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#:Microwave and Optical Technology Letters, vol. 56, no. 12, Dec. 2014, pp. 3015-3020.
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::by D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd
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# M. Kwon, M. Kim, and D. Kam, “Optimization of a defected ground structure to improve electromagnetic bandgap performance,”
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::IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144
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#:Journal of Electromagnetic Engineering and Science, vol. 14, no. 4, Dec. 2014, pp. 346-348.
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*"A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications"
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# D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,”
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::by A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd
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#:IEICE Electronics Express, vol. 11, no. 12, Jun. 2014, pp. 1-5.
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::IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773
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# M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,”
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*"Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure"
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, no. 3, Mar. 2014, pp. 496-503.
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::by J. Shim, D. Kam, J. Kwon, and J. Kim
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,”
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::IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814.
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*"Is 25 Gb/s on-board signaling viable? (invited)"
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# D. Kam and J. Kim, “Foreword: special section on through silicon vias,”
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::by D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153.
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::IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344
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# A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,”
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*"Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis"
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#:IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075.
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::by G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim
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# A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),”
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::IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972
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#:IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131.
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*"40-Gb/s package design using wire-bonded plastic ball grid array"
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,”
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::by D. Kam and J. Kim
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#:IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144.
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::IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266
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# A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,”
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*"Multiport measurement method using a two-port network analyzer with remaining ports unterminated"
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#:IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773.
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::by D. Kam and J. Kim
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# J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,”
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::IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696
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#:IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577.
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*"Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications"
+
# D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)”
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::by J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan
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#:IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344.
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::IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190
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# G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,”
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*"Modeling and measurement of simultaneous switching noise coupling through signal via transition"
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#:IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972.
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::by J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim
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# D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,”
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::IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559
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#:IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266.
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*"Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array"
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# D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,”
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::by D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim
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#:IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696.
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::IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219
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# J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
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*"Spread spectrum clock generator with delay cell array to reduce electromagnetic interference"
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#:IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190.
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::by J. Kim, D. Kam, P. Jun, and J. Kim
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# J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,”
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::IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920
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#:IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
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*"Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole"
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# D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,”
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::by H. Lee, Y. Hong, D. Kam, and J. Kim
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#:IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219.
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::IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173
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# J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,”
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*"Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission"
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#:IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920.
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::by D. Kam, H. Lee, and J. Kim
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# H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
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::IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596
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#:IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173.
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*"A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise"
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# D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,”
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::by D. Kam, H. Lee, J. Kim, and J. Kim
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#:IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596.
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::IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413
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# D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,”
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*"RF interconnect for multi-Gbit/s board-level clock distribution"
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#:IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413.
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::by W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim
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# W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,”
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::IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407
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#:IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407.
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=='''CONFERENCES'''==
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#S. Park, M. Kotzev, and D. Kam, "Lessons from Validation of Computational Electromagnetics Computer Modeling and Simulations Based on IEEE Standard 1597,"
 +
#: IEEE International Microwave Symposium (IMS), Honolulu, USA, June 2017.
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#D. Kam, "Reinvention of the third dimension of a printed circuit board,"
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#: Vietnam-Korea Workshop on Electromagnetics, Hanoi, Vietnam, Feb. 2016.
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#S. Yeon and D. Kam, "Reduction of P/G impedance by edge plating,"
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#: IEEE EDAPS, Seoul, Korea, Dec. 2015.
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#H. Seo and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
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#: IEEE EDAPS, Seoul, Korea, Dec. 2015.
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#W. Park and D. Kam, “Quantifying the impact of differential-to-common mode conversion on RFI,”
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#: IEEE EDAPS, Seoul, Korea, Dec. 2015.
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#H. Park and D. Kam, “A circularly polarized via antenna for 5G front-end modules,”
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#: Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
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#J. Park and D. Kam, “A via antenna for 5G front-end modules,”
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#: Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
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#H. Park, D. Kam, and E. Song, “RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices,”
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#: EMC Compo, Edinburgh, UK, Nov. 2015.
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#H. Seo and D. Kam, “60 GHz 대역 패키지 내장 안테나의 이득 변화 연구,”
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#: 한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
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#W. Park and D. Kam, “Recessed probe launch를 사용한 PCB 유전율 추출,”
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#:한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
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#S. Park, M. Kwon, and D. Kam, “Design methodology for 77-GHz automotive radar frontend modules,”
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#: Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
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#D. Kam, “Recent progress in millimeter-wave packaging (invited),”
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#: Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
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# D. Kam, “전자파 재료의 물성 측정 방법 (Invited),”
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#: EMC Korea, Oct. 2013.
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# D. Kam, “Advanced packaging technologies for millimeter-wave applications (Invited),”
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#:제13회 RF집적회로 기술 Workshop, Sep. 2013.
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# D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),”
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#:한국전자파학회 하계종합학술대회, Aug. 2013.
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# X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,”
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#: Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013.
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# D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),”
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#:마이크로전자및패키징학회, Nov. 2012.
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# D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),”
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#: EMC Korea, Aug. 2012.
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# D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),”
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#:2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012.
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# D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012.
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# D. Kam, “Package design for 60-GHz wireless chipsets (Invited),”
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#:한국전자파학회 종합학술대회, Nov. 2011.
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# D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),”
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#: International Microwave Symposium (IMS), Baltimore, MD, June 2011.
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,”
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#: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010.
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# D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial),"
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#: IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010.
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# A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial),"
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#: International Microwave Symposium (IMS), Anaheim, CA, May 2010.
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# S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,”
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#: Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010.
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# B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),”
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#: Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010.
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# J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),”
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#: SPIE Photonics West, San Jose, CA, Jan. 2009.
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# M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,”
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#: Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008.
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# D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,”
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#: IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award).
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# P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),”
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#: SPIE Photonics West, San Jose, CA, Jan. 2008.
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# D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,”
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#: Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007.
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# E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,”
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#: Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007.
 +
# E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,”
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#: IEEE Electronics System-Integration Technology Conference  (ISTC), Dresden, Germany, Sep. 2006.
 +
# G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,”
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#: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006.
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# D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,”
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#: Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006.
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# E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,”
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#: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005.
 +
# J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
 +
#: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005.
 +
# H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,”
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#: Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005.
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# G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,”
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#: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004.
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# J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004.
 +
# J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,”
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#: International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004.
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# H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
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#: IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004.
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# D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,”
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#: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003.
 +
# D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,”
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#: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
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# S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,”
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#: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
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# D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,”
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#: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002.
 +
# D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,”
 +
#: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
 +
# S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,”
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#: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
 +
# D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,”
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#: Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002.
 +
# H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,”
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#: IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002.
 +
 
 +
=='''PATENTS'''==
 +
#D. Kam and M. Maeng, "Folding patch antenna using aperture coupled feed and manufacturing method thereof,:
 +
#: Korea Patent, 10-2016-0088155, Aug. 31, 2017.
 +
#D. Kam and S. Park, “End-fire antenna using via and manufacturing method for the same,”
 +
#: Korea Patent, 10-1712-8680000, Feb. 28, 2017.
 +
#D. Kam and M. Kwon, “Method for suppressing specific harmonics using signal waveform control,”
 +
#: Korea Patent Application, 10-2015-0007472, Jan. 15, 2015.
 +
#D. Kam, D. Liu, and S. Reynolds, “Antenna array package and method for building large arrays,”
 +
#: US Patent, 8,816,929, Aug. 26, 2014.
 +
#D. Kam, D. Liu, A. Natarajan, S. Reynolds, and A. Garcia, “Phased array millimeter wave imaging techniques,”
 +
#:US Patent 8,456,351, June 4, 2013. (WO/2011/133232)
 +
#M. Gaynes, D. Kam, D. Liu, and S. Reynolds, “Thermal interface material application for integrated circuit cooling,”
 +
#: US Patent 8,411,444, Apr. 2, 2013.
 +
#D. Kam, D. Liu, and S. Reynolds, “Integrated antenna for RFIC package applications,”
 +
#: US Patent Application, 13/029,657, Feb. 17, 2011.
 +
#J. Kim, P. Jun, J. Kim, D. Kam, and J. Byun, “Spread spectrum clock generator,”
 +
#: Korea Patent 10-0926684, Nov. 6, 2009.
 +
#J. Kim, P. Jun, J. Byun, D. Kam, and J. Kim, “Spread spectrum clock generator,”
 +
#: US Patent 7,304,522, Dec. 4, 2007.
 +
#J. Kwon, J. Shim, H. Choi, D. Kam, and J. Kim, “Method for evaluating shielding effectiveness of enclosure with apertures using circuit modeling,”
 +
#: Korea Patent 10-0691302, Feb. 28, 2007.
 +
#D. Kam, J. Kim, and J. Kim, “Spread spectrum clock generator based on phase inversion,”
 +
#: Korea Patent 10-0456285, Oct. 29, 2004.

Latest revision as of 07:48, 18 October 2017

JOURNALS

  1. Sangwook Park, Miroslav Kotzev, Heinz-D. Brüns, Dong Gun Kam, and Christian Schuster, “Lessons from Applying IEEE Standard 1597 for Validation of Computational Electromagnetics Computer Modeling and Simulations,”
    IEEE Electromagnetic Compatibility Magazine, vol. 6, Q. 2, Aug. 2017, pp. 55-67.
  2. H. Seo, W. Hong, and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
    Microwave and Optical Technology Letters, vol. 58, no. 4, Apr. 2016, pp. 745-747.
  3. M. Kwon and D. Kam, “Removal of specific harmonic by edge rate control for RFI mitigation,”
    IEEE Trans. Electromagnetic Compatibility, vol. 57, no. 5, Oct. 2015, pp. 1274-1276.
  4. M. Kim and D. Kam, “Wideband and compact EBG structure with balanced slots,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 5, no. 6, June 2015, pp. 818-827.
  5. C. Hwang, W. Park, and D. Kam, “Complex permittivity extraction from PCB stripline measurement using recessed probe launch,”
    IEICE Electronics Express, vol. 12, no. 5, Mar. 2015, pp. 1-8.
  6. S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,”
    Microwave and Optical Technology Letters, vol. 56, no. 12, Dec. 2014, pp. 3015-3020.
  7. M. Kwon, M. Kim, and D. Kam, “Optimization of a defected ground structure to improve electromagnetic bandgap performance,”
    Journal of Electromagnetic Engineering and Science, vol. 14, no. 4, Dec. 2014, pp. 346-348.
  8. D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,”
    IEICE Electronics Express, vol. 11, no. 12, Jun. 2014, pp. 1-5.
  9. M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, no. 3, Mar. 2014, pp. 496-503.
  10. D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814.
  11. D. Kam and J. Kim, “Foreword: special section on through silicon vias,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153.
  12. A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,”
    IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075.
  13. A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),”
    IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131.
  14. D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,”
    IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144.
  15. A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,”
    IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773.
  16. J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,”
    IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577.
  17. D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)”
    IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344.
  18. G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,”
    IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972.
  19. D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,”
    IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266.
  20. D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,”
    IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696.
  21. J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
    IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190.
  22. J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,”
    IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
  23. D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,”
    IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219.
  24. J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,”
    IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920.
  25. H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
    IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173.
  26. D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,”
    IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596.
  27. D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,”
    IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413.
  28. W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,”
    IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407.

CONFERENCES

  1. S. Park, M. Kotzev, and D. Kam, "Lessons from Validation of Computational Electromagnetics Computer Modeling and Simulations Based on IEEE Standard 1597,"
    IEEE International Microwave Symposium (IMS), Honolulu, USA, June 2017.
  2. D. Kam, "Reinvention of the third dimension of a printed circuit board,"
    Vietnam-Korea Workshop on Electromagnetics, Hanoi, Vietnam, Feb. 2016.
  3. S. Yeon and D. Kam, "Reduction of P/G impedance by edge plating,"
    IEEE EDAPS, Seoul, Korea, Dec. 2015.
  4. H. Seo and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
    IEEE EDAPS, Seoul, Korea, Dec. 2015.
  5. W. Park and D. Kam, “Quantifying the impact of differential-to-common mode conversion on RFI,”
    IEEE EDAPS, Seoul, Korea, Dec. 2015.
  6. H. Park and D. Kam, “A circularly polarized via antenna for 5G front-end modules,”
    Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
  7. J. Park and D. Kam, “A via antenna for 5G front-end modules,”
    Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
  8. H. Park, D. Kam, and E. Song, “RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices,”
    EMC Compo, Edinburgh, UK, Nov. 2015.
  9. H. Seo and D. Kam, “60 GHz 대역 패키지 내장 안테나의 이득 변화 연구,”
    한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
  10. W. Park and D. Kam, “Recessed probe launch를 사용한 PCB 유전율 추출,”
    한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
  11. S. Park, M. Kwon, and D. Kam, “Design methodology for 77-GHz automotive radar frontend modules,”
    Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
  12. D. Kam, “Recent progress in millimeter-wave packaging (invited),”
    Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
  13. D. Kam, “전자파 재료의 물성 측정 방법 (Invited),”
    EMC Korea, Oct. 2013.
  14. D. Kam, “Advanced packaging technologies for millimeter-wave applications (Invited),”
    제13회 RF집적회로 기술 Workshop, Sep. 2013.
  15. D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),”
    한국전자파학회 하계종합학술대회, Aug. 2013.
  16. X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,”
    Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013.
  17. D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),”
    마이크로전자및패키징학회, Nov. 2012.
  18. D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),”
    EMC Korea, Aug. 2012.
  19. D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),”
    2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012.
  20. D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012.
  21. D. Kam, “Package design for 60-GHz wireless chipsets (Invited),”
    한국전자파학회 종합학술대회, Nov. 2011.
  22. D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),”
    International Microwave Symposium (IMS), Baltimore, MD, June 2011.
  23. D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,”
    IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010.
  24. D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial),"
    IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010.
  25. A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial),"
    International Microwave Symposium (IMS), Anaheim, CA, May 2010.
  26. S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,”
    Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010.
  27. B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),”
    Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010.
  28. J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),”
    SPIE Photonics West, San Jose, CA, Jan. 2009.
  29. M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,”
    Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008.
  30. D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,”
    IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award).
  31. P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),”
    SPIE Photonics West, San Jose, CA, Jan. 2008.
  32. D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,”
    Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007.
  33. E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,”
    Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007.
  34. E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,”
    IEEE Electronics System-Integration Technology Conference (ISTC), Dresden, Germany, Sep. 2006.
  35. G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006.
  36. D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,”
    Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006.
  37. E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005.
  38. J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005.
  39. H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,”
    Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005.
  40. G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004.
  41. J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004.
  42. J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,”
    International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004.
  43. H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
    IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004.
  44. D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003.
  45. D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
  46. S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
  47. D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,”
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002.
  48. D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
  49. S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
  50. D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,”
    Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002.
  51. H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,”
    IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002.

PATENTS

  1. D. Kam and M. Maeng, "Folding patch antenna using aperture coupled feed and manufacturing method thereof,:
    Korea Patent, 10-2016-0088155, Aug. 31, 2017.
  2. D. Kam and S. Park, “End-fire antenna using via and manufacturing method for the same,”
    Korea Patent, 10-1712-8680000, Feb. 28, 2017.
  3. D. Kam and M. Kwon, “Method for suppressing specific harmonics using signal waveform control,”
    Korea Patent Application, 10-2015-0007472, Jan. 15, 2015.
  4. D. Kam, D. Liu, and S. Reynolds, “Antenna array package and method for building large arrays,”
    US Patent, 8,816,929, Aug. 26, 2014.
  5. D. Kam, D. Liu, A. Natarajan, S. Reynolds, and A. Garcia, “Phased array millimeter wave imaging techniques,”
    US Patent 8,456,351, June 4, 2013. (WO/2011/133232)
  6. M. Gaynes, D. Kam, D. Liu, and S. Reynolds, “Thermal interface material application for integrated circuit cooling,”
    US Patent 8,411,444, Apr. 2, 2013.
  7. D. Kam, D. Liu, and S. Reynolds, “Integrated antenna for RFIC package applications,”
    US Patent Application, 13/029,657, Feb. 17, 2011.
  8. J. Kim, P. Jun, J. Kim, D. Kam, and J. Byun, “Spread spectrum clock generator,”
    Korea Patent 10-0926684, Nov. 6, 2009.
  9. J. Kim, P. Jun, J. Byun, D. Kam, and J. Kim, “Spread spectrum clock generator,”
    US Patent 7,304,522, Dec. 4, 2007.
  10. J. Kwon, J. Shim, H. Choi, D. Kam, and J. Kim, “Method for evaluating shielding effectiveness of enclosure with apertures using circuit modeling,”
    Korea Patent 10-0691302, Feb. 28, 2007.
  11. D. Kam, J. Kim, and J. Kim, “Spread spectrum clock generator based on phase inversion,”
    Korea Patent 10-0456285, Oct. 29, 2004.
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