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− | + | =='''JOURNALS'''== | |
− | :: | + | # Sangwook Park, Miroslav Kotzev, Heinz-D. Brüns, Dong Gun Kam, and Christian Schuster, “Lessons from Applying IEEE Standard 1597 for Validation of Computational Electromagnetics Computer Modeling and Simulations,” |
− | + | #:IEEE Electromagnetic Compatibility Magazine, vol. 6, Q. 2, Aug. 2017, pp. 55-67. | |
− | + | # H. Seo, W. Hong, and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,” | |
− | + | #:Microwave and Optical Technology Letters, vol. 58, no. 4, Apr. 2016, pp. 745-747. | |
− | + | # M. Kwon and D. Kam, “Removal of specific harmonic by edge rate control for RFI mitigation,” | |
− | + | #:IEEE Trans. Electromagnetic Compatibility, vol. 57, no. 5, Oct. 2015, pp. 1274-1276. | |
− | + | # M. Kim and D. Kam, “Wideband and compact EBG structure with balanced slots,” | |
− | + | #:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 5, no. 6, June 2015, pp. 818-827. | |
− | + | # C. Hwang, W. Park, and D. Kam, “Complex permittivity extraction from PCB stripline measurement using recessed probe launch,” | |
− | + | #:IEICE Electronics Express, vol. 12, no. 5, Mar. 2015, pp. 1-8. | |
− | + | # S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,” | |
− | + | #:Microwave and Optical Technology Letters, vol. 56, no. 12, Dec. 2014, pp. 3015-3020. | |
− | + | # M. Kwon, M. Kim, and D. Kam, “Optimization of a defected ground structure to improve electromagnetic bandgap performance,” | |
− | + | #:Journal of Electromagnetic Engineering and Science, vol. 14, no. 4, Dec. 2014, pp. 346-348. | |
− | + | # D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,” | |
− | + | #:IEICE Electronics Express, vol. 11, no. 12, Jun. 2014, pp. 1-5. | |
− | + | # M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,” | |
− | + | #:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, no. 3, Mar. 2014, pp. 496-503. | |
− | + | # D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,” | |
− | + | #:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814. | |
− | + | # D. Kam and J. Kim, “Foreword: special section on through silicon vias,” | |
− | + | #:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153. | |
− | + | # A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,” | |
− | + | #:IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075. | |
− | + | # A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),” | |
− | + | #:IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131. | |
− | + | # D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,” | |
− | + | #:IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144. | |
− | + | # A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,” | |
− | + | #:IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773. | |
− | + | # J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,” | |
− | + | #:IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577. | |
− | + | # D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344. | |
− | + | # G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,” | |
− | + | #:IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972. | |
− | + | # D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266. | |
− | + | # D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,” | |
− | + | #:IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696. | |
− | + | # J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190. | |
− | + | # J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559. | |
− | + | # D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,” | |
− | + | #:IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219. | |
− | + | # J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,” | |
− | + | #:IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920. | |
− | + | # H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173. | |
− | + | # D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,” | |
− | + | #:IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596. | |
− | + | # D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,” | |
− | + | #:IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413. | |
− | ::by W. Ryu, J. Lee, H. Kim, S. Ahn, | + | # W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,” |
− | ::IEEE | + | #:IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407. |
+ | |||
+ | =='''CONFERENCES'''== | ||
+ | #S. Park, M. Kotzev, and D. Kam, "Lessons from Validation of Computational Electromagnetics Computer Modeling and Simulations Based on IEEE Standard 1597," | ||
+ | #: IEEE International Microwave Symposium (IMS), Honolulu, USA, June 2017. | ||
+ | #D. Kam, "Reinvention of the third dimension of a printed circuit board," | ||
+ | #: Vietnam-Korea Workshop on Electromagnetics, Hanoi, Vietnam, Feb. 2016. | ||
+ | #S. Yeon and D. Kam, "Reduction of P/G impedance by edge plating," | ||
+ | #: IEEE EDAPS, Seoul, Korea, Dec. 2015. | ||
+ | #H. Seo and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,” | ||
+ | #: IEEE EDAPS, Seoul, Korea, Dec. 2015. | ||
+ | #W. Park and D. Kam, “Quantifying the impact of differential-to-common mode conversion on RFI,” | ||
+ | #: IEEE EDAPS, Seoul, Korea, Dec. 2015. | ||
+ | #H. Park and D. Kam, “A circularly polarized via antenna for 5G front-end modules,” | ||
+ | #: Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015. | ||
+ | #J. Park and D. Kam, “A via antenna for 5G front-end modules,” | ||
+ | #: Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015. | ||
+ | #H. Park, D. Kam, and E. Song, “RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices,” | ||
+ | #: EMC Compo, Edinburgh, UK, Nov. 2015. | ||
+ | #H. Seo and D. Kam, “60 GHz 대역 패키지 내장 안테나의 이득 변화 연구,” | ||
+ | #: 한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014. | ||
+ | #W. Park and D. Kam, “Recessed probe launch를 사용한 PCB 유전율 추출,” | ||
+ | #:한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014. | ||
+ | #S. Park, M. Kwon, and D. Kam, “Design methodology for 77-GHz automotive radar frontend modules,” | ||
+ | #: Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014. | ||
+ | #D. Kam, “Recent progress in millimeter-wave packaging (invited),” | ||
+ | #: Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014. | ||
+ | # D. Kam, “전자파 재료의 물성 측정 방법 (Invited),” | ||
+ | #: EMC Korea, Oct. 2013. | ||
+ | # D. Kam, “Advanced packaging technologies for millimeter-wave applications (Invited),” | ||
+ | #:제13회 RF집적회로 기술 Workshop, Sep. 2013. | ||
+ | # D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),” | ||
+ | #:한국전자파학회 하계종합학술대회, Aug. 2013. | ||
+ | # X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,” | ||
+ | #: Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013. | ||
+ | # D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),” | ||
+ | #:마이크로전자및패키징학회, Nov. 2012. | ||
+ | # D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),” | ||
+ | #: EMC Korea, Aug. 2012. | ||
+ | # D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),” | ||
+ | #:2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012. | ||
+ | # D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012. | ||
+ | # D. Kam, “Package design for 60-GHz wireless chipsets (Invited),” | ||
+ | #:한국전자파학회 종합학술대회, Nov. 2011. | ||
+ | # D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),” | ||
+ | #: International Microwave Symposium (IMS), Baltimore, MD, June 2011. | ||
+ | # D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,” | ||
+ | #: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010. | ||
+ | # D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial)," | ||
+ | #: IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010. | ||
+ | # A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial)," | ||
+ | #: International Microwave Symposium (IMS), Anaheim, CA, May 2010. | ||
+ | # S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,” | ||
+ | #: Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010. | ||
+ | # B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),” | ||
+ | #: Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010. | ||
+ | # J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),” | ||
+ | #: SPIE Photonics West, San Jose, CA, Jan. 2009. | ||
+ | # M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,” | ||
+ | #: Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008. | ||
+ | # D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,” | ||
+ | #: IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award). | ||
+ | # P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),” | ||
+ | #: SPIE Photonics West, San Jose, CA, Jan. 2008. | ||
+ | # D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,” | ||
+ | #: Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007. | ||
+ | # E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,” | ||
+ | #: Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007. | ||
+ | # E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,” | ||
+ | #: IEEE Electronics System-Integration Technology Conference (ISTC), Dresden, Germany, Sep. 2006. | ||
+ | # G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,” | ||
+ | #: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006. | ||
+ | # D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,” | ||
+ | #: Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006. | ||
+ | # E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,” | ||
+ | #: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005. | ||
+ | # J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,” | ||
+ | #: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005. | ||
+ | # H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,” | ||
+ | #: Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005. | ||
+ | # G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,” | ||
+ | #: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004. | ||
+ | # J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,” | ||
+ | #:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004. | ||
+ | # J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,” | ||
+ | #: International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004. | ||
+ | # H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,” | ||
+ | #: IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004. | ||
+ | # D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,” | ||
+ | #: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003. | ||
+ | # D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,” | ||
+ | #: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002. | ||
+ | # S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,” | ||
+ | #: Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002. | ||
+ | # D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,” | ||
+ | #: IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002. | ||
+ | # D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,” | ||
+ | #: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002. | ||
+ | # S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,” | ||
+ | #: IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002. | ||
+ | # D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,” | ||
+ | #: Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002. | ||
+ | # H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,” | ||
+ | #: IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002. | ||
+ | |||
+ | =='''PATENTS'''== | ||
+ | #D. Kam and M. Maeng, "Folding patch antenna using aperture coupled feed and manufacturing method thereof,: | ||
+ | #: Korea Patent, 10-2016-0088155, Aug. 31, 2017. | ||
+ | #D. Kam and S. Park, “End-fire antenna using via and manufacturing method for the same,” | ||
+ | #: Korea Patent, 10-1712-8680000, Feb. 28, 2017. | ||
+ | #D. Kam and M. Kwon, “Method for suppressing specific harmonics using signal waveform control,” | ||
+ | #: Korea Patent Application, 10-2015-0007472, Jan. 15, 2015. | ||
+ | #D. Kam, D. Liu, and S. Reynolds, “Antenna array package and method for building large arrays,” | ||
+ | #: US Patent, 8,816,929, Aug. 26, 2014. | ||
+ | #D. Kam, D. Liu, A. Natarajan, S. Reynolds, and A. Garcia, “Phased array millimeter wave imaging techniques,” | ||
+ | #:US Patent 8,456,351, June 4, 2013. (WO/2011/133232) | ||
+ | #M. Gaynes, D. Kam, D. Liu, and S. Reynolds, “Thermal interface material application for integrated circuit cooling,” | ||
+ | #: US Patent 8,411,444, Apr. 2, 2013. | ||
+ | #D. Kam, D. Liu, and S. Reynolds, “Integrated antenna for RFIC package applications,” | ||
+ | #: US Patent Application, 13/029,657, Feb. 17, 2011. | ||
+ | #J. Kim, P. Jun, J. Kim, D. Kam, and J. Byun, “Spread spectrum clock generator,” | ||
+ | #: Korea Patent 10-0926684, Nov. 6, 2009. | ||
+ | #J. Kim, P. Jun, J. Byun, D. Kam, and J. Kim, “Spread spectrum clock generator,” | ||
+ | #: US Patent 7,304,522, Dec. 4, 2007. | ||
+ | #J. Kwon, J. Shim, H. Choi, D. Kam, and J. Kim, “Method for evaluating shielding effectiveness of enclosure with apertures using circuit modeling,” | ||
+ | #: Korea Patent 10-0691302, Feb. 28, 2007. | ||
+ | #D. Kam, J. Kim, and J. Kim, “Spread spectrum clock generator based on phase inversion,” | ||
+ | #: Korea Patent 10-0456285, Oct. 29, 2004. |
Latest revision as of 07:48, 18 October 2017
JOURNALS
- Sangwook Park, Miroslav Kotzev, Heinz-D. Brüns, Dong Gun Kam, and Christian Schuster, “Lessons from Applying IEEE Standard 1597 for Validation of Computational Electromagnetics Computer Modeling and Simulations,”
- IEEE Electromagnetic Compatibility Magazine, vol. 6, Q. 2, Aug. 2017, pp. 55-67.
- H. Seo, W. Hong, and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
- Microwave and Optical Technology Letters, vol. 58, no. 4, Apr. 2016, pp. 745-747.
- M. Kwon and D. Kam, “Removal of specific harmonic by edge rate control for RFI mitigation,”
- IEEE Trans. Electromagnetic Compatibility, vol. 57, no. 5, Oct. 2015, pp. 1274-1276.
- M. Kim and D. Kam, “Wideband and compact EBG structure with balanced slots,”
- IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 5, no. 6, June 2015, pp. 818-827.
- C. Hwang, W. Park, and D. Kam, “Complex permittivity extraction from PCB stripline measurement using recessed probe launch,”
- IEICE Electronics Express, vol. 12, no. 5, Mar. 2015, pp. 1-8.
- S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,”
- Microwave and Optical Technology Letters, vol. 56, no. 12, Dec. 2014, pp. 3015-3020.
- M. Kwon, M. Kim, and D. Kam, “Optimization of a defected ground structure to improve electromagnetic bandgap performance,”
- Journal of Electromagnetic Engineering and Science, vol. 14, no. 4, Dec. 2014, pp. 346-348.
- D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,”
- IEICE Electronics Express, vol. 11, no. 12, Jun. 2014, pp. 1-5.
- M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,”
- IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, no. 3, Mar. 2014, pp. 496-503.
- D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,”
- IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814.
- D. Kam and J. Kim, “Foreword: special section on through silicon vias,”
- IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153.
- A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,”
- IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075.
- A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),”
- IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131.
- D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,”
- IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144.
- A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,”
- IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773.
- J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,”
- IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577.
- D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)”
- IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344.
- G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,”
- IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972.
- D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,”
- IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266.
- D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,”
- IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696.
- J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
- IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190.
- J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,”
- IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
- D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,”
- IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219.
- J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,”
- IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920.
- H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
- IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173.
- D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,”
- IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596.
- D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,”
- IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413.
- W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,”
- IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407.
CONFERENCES
- S. Park, M. Kotzev, and D. Kam, "Lessons from Validation of Computational Electromagnetics Computer Modeling and Simulations Based on IEEE Standard 1597,"
- IEEE International Microwave Symposium (IMS), Honolulu, USA, June 2017.
- D. Kam, "Reinvention of the third dimension of a printed circuit board,"
- Vietnam-Korea Workshop on Electromagnetics, Hanoi, Vietnam, Feb. 2016.
- S. Yeon and D. Kam, "Reduction of P/G impedance by edge plating,"
- IEEE EDAPS, Seoul, Korea, Dec. 2015.
- H. Seo and D. Kam, “Gain variation of 60-GHz patch antennas due to ground plane dimensions,”
- IEEE EDAPS, Seoul, Korea, Dec. 2015.
- W. Park and D. Kam, “Quantifying the impact of differential-to-common mode conversion on RFI,”
- IEEE EDAPS, Seoul, Korea, Dec. 2015.
- H. Park and D. Kam, “A circularly polarized via antenna for 5G front-end modules,”
- Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
- J. Park and D. Kam, “A via antenna for 5G front-end modules,”
- Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), Sendai, Japan, Nov. 2015.
- H. Park, D. Kam, and E. Song, “RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devices,”
- EMC Compo, Edinburgh, UK, Nov. 2015.
- H. Seo and D. Kam, “60 GHz 대역 패키지 내장 안테나의 이득 변화 연구,”
- 한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
- W. Park and D. Kam, “Recessed probe launch를 사용한 PCB 유전율 추출,”
- 한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
- S. Park, M. Kwon, and D. Kam, “Design methodology for 77-GHz automotive radar frontend modules,”
- Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
- D. Kam, “Recent progress in millimeter-wave packaging (invited),”
- Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
- D. Kam, “전자파 재료의 물성 측정 방법 (Invited),”
- EMC Korea, Oct. 2013.
- D. Kam, “Advanced packaging technologies for millimeter-wave applications (Invited),”
- 제13회 RF집적회로 기술 Workshop, Sep. 2013.
- D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),”
- 한국전자파학회 하계종합학술대회, Aug. 2013.
- X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,”
- Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013.
- D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),”
- 마이크로전자및패키징학회, Nov. 2012.
- D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),”
- EMC Korea, Aug. 2012.
- D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),”
- 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012.
- D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012.
- D. Kam, “Package design for 60-GHz wireless chipsets (Invited),”
- 한국전자파학회 종합학술대회, Nov. 2011.
- D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),”
- International Microwave Symposium (IMS), Baltimore, MD, June 2011.
- D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,”
- IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010.
- D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial),"
- IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010.
- A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial),"
- International Microwave Symposium (IMS), Anaheim, CA, May 2010.
- S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,”
- Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010.
- B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),”
- Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010.
- J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),”
- SPIE Photonics West, San Jose, CA, Jan. 2009.
- M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,”
- Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008.
- D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,”
- IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award).
- P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),”
- SPIE Photonics West, San Jose, CA, Jan. 2008.
- D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,”
- Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007.
- E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,”
- Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007.
- E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,”
- IEEE Electronics System-Integration Technology Conference (ISTC), Dresden, Germany, Sep. 2006.
- G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,”
- IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006.
- D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,”
- Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006.
- E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,”
- Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005.
- J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
- IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005.
- H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,”
- Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005.
- G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,”
- Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004.
- J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,”
- IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004.
- J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,”
- International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004.
- H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
- IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004.
- D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,”
- IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003.
- D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,”
- Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
- S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,”
- Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
- D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,”
- IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002.
- D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,”
- IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
- S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,”
- IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
- D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,”
- Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002.
- H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,”
- IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002.
PATENTS
- D. Kam and M. Maeng, "Folding patch antenna using aperture coupled feed and manufacturing method thereof,:
- Korea Patent, 10-2016-0088155, Aug. 31, 2017.
- D. Kam and S. Park, “End-fire antenna using via and manufacturing method for the same,”
- Korea Patent, 10-1712-8680000, Feb. 28, 2017.
- D. Kam and M. Kwon, “Method for suppressing specific harmonics using signal waveform control,”
- Korea Patent Application, 10-2015-0007472, Jan. 15, 2015.
- D. Kam, D. Liu, and S. Reynolds, “Antenna array package and method for building large arrays,”
- US Patent, 8,816,929, Aug. 26, 2014.
- D. Kam, D. Liu, A. Natarajan, S. Reynolds, and A. Garcia, “Phased array millimeter wave imaging techniques,”
- US Patent 8,456,351, June 4, 2013. (WO/2011/133232)
- M. Gaynes, D. Kam, D. Liu, and S. Reynolds, “Thermal interface material application for integrated circuit cooling,”
- US Patent 8,411,444, Apr. 2, 2013.
- D. Kam, D. Liu, and S. Reynolds, “Integrated antenna for RFIC package applications,”
- US Patent Application, 13/029,657, Feb. 17, 2011.
- J. Kim, P. Jun, J. Kim, D. Kam, and J. Byun, “Spread spectrum clock generator,”
- Korea Patent 10-0926684, Nov. 6, 2009.
- J. Kim, P. Jun, J. Byun, D. Kam, and J. Kim, “Spread spectrum clock generator,”
- US Patent 7,304,522, Dec. 4, 2007.
- J. Kwon, J. Shim, H. Choi, D. Kam, and J. Kim, “Method for evaluating shielding effectiveness of enclosure with apertures using circuit modeling,”
- Korea Patent 10-0691302, Feb. 28, 2007.
- D. Kam, J. Kim, and J. Kim, “Spread spectrum clock generator based on phase inversion,”
- Korea Patent 10-0456285, Oct. 29, 2004.