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=='''JOURNALS'''==
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[https://scholar.google.com/citations?user=9RBRB_4AAAAJ Google Scholar Profile]
# C. Hwang, W. Park, and D. Kam, “Complex permittivity extraction from PCB stripline measurement using recessed probe launch,”
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#:Microwave and Optical Technology Letters, under review.
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# S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,”
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#:Microwave and Optical Technology Letters, to be published.
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# D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,”
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#:IEICE Electronics Express, vol. 11, no. 12, Jun. 2014, pp. 1-5.
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# M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,”
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 4, no. 3, Mar. 2014, pp. 496-503.
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,”
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814.
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# D. Kam and J. Kim, “Foreword: special section on through silicon vias,”
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#:IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153.
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# A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,”
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#:IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075.
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# A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),”
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#:IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131.
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,”
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#:IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144.
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# A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,”
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#:IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773.
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# J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,”
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#:IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577.
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# D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)”
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#:IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344.
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# G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,”
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#:IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972.
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# D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,”
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#:IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266.
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# D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,”
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#:IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696.
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# J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
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#:IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190.
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# J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,”
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#:IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
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# D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,”
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#:IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219.
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# J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,”
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#:IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920.
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# H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
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#:IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173.
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# D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,”
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#:IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596.
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# D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,”
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#:IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413.
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# W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,”
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#:IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407.
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=='''CONFERENCES'''==
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#H. Seo and D. Kam, “60 GHz 대역 패키지 내장 안테나의 이득 변화 연구,”
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#: 한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
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#W. Park and D. Kam, “Recessed probe launch를 사용한 PCB 유전율 추출,”
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#:한국전자파학회 하계종합학술대회, Jeju, Korea, Aug. 2014.
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#S. Park, M. Kwon, and D. Kam, “Design methodology for 77-GHz automotive radar frontend modules,”
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#:Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
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#D. Kam, “Recent progress in millimeter-wave packaging (invited),”
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#:Global Symposium on Millimeter-waves (GSMM), Seoul, Korea, May 2014.
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# D. Kam, “전자파 재료의 물성 측정 방법 (Invited),”
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#:EMC Korea, Oct. 2013.
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# D. Kam, “Advanced packaging technologies for millimeter-wave applications (Invited),”
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#:제13회 RF집적회로 기술 Workshop, Sep. 2013.
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# D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),”
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#:한국전자파학회 하계종합학술대회, Aug. 2013.
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# X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,”
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#:Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013.
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# D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),”
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#:마이크로전자및패키징학회, Nov. 2012.
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# D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),”
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#:EMC Korea, Aug. 2012.
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# D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),”
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#:2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012.
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# D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012.
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# D. Kam, “Package design for 60-GHz wireless chipsets (Invited),”
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#:한국전자파학회 종합학술대회, Nov. 2011.
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# D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),”
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#:International Microwave Symposium (IMS), Baltimore, MD, June 2011.
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# D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,”
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#:IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010.
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# D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial),"
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#:IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010.
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# A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial),"
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#:International Microwave Symposium (IMS), Anaheim, CA, May 2010.
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# S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,”
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#:Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010.
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# B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),”
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#:Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010.
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# J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),”
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#:SPIE Photonics West, San Jose, CA, Jan. 2009.
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# M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,”
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#:Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008.
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# D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,”
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#:IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award).
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# P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),”
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#:SPIE Photonics West, San Jose, CA, Jan. 2008.
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# D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,”
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#:Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007.
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# E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,”
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#:Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007.
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# E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,”
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#:IEEE Electronics System-Integration Technology Conference  (ISTC), Dresden, Germany, Sep. 2006.
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# G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006.
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# D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,”
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#:Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006.
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# E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,”
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#:Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005.
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# J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
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#:IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005.
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# H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,”
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#:Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005.
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# G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,”
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#:Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004.
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# J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004.
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# J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,”
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#:International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004.
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# H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
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#:IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004.
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# D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003.
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# D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,”
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#:Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
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# S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,”
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#:Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
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# D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,”
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#:IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002.
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# D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
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# S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,”
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#:IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
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# D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,”
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#:Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002.
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# H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,”
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#:IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002.
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=='''PATENTS'''==
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#D. Kam, D. Liu, and S. Reynolds, “Antenna array package and method for building large arrays,”
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#: US Patent, 8,816,929, Aug. 26, 2014.
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#D. Kam, D. Liu, A. Natarajan, S. Reynolds, and A. Garcia, “Phased array millimeter wave imaging techniques,”
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#:US Patent 8,456,351, June 4, 2013. (WO/2011/133232)
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#M. Gaynes, D. Kam, D. Liu, and S. Reynolds, “Thermal interface material application for integrated circuit cooling,”
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#: US Patent 8,411,444, Apr. 2, 2013.
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#D. Kam, D. Liu, and S. Reynolds, “Integrated antenna for RFIC package applications,”
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#: US Patent Application 13/029,657, Feb. 17, 2011.
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# J. Kim, P. Jun, J. Kim, D. Kam, and J. Byun, “Spread spectrum clock generator,”
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#: Korean Patent 10-0926684, Nov. 6, 2009.
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# J. Kim, P. Jun, J. Byun, D. Kam, and J. Kim, “Spread spectrum clock generator,”
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#: US Patent 7,304,522, Dec. 4, 2007.
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# J. Kwon, J. Shim, H. Choi, D. Kam, and J. Kim, “Method for evaluating shielding effectiveness of enclosure with apertures using circuit modeling,”
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#: Korean Patent 10-0691302, Feb. 28, 2007.
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[8] D. Kam, J. Kim, and J. Kim, “Spread spectrum clock generator based on phase inversion,”
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#: Korean Patent 10-0456285, Oct. 29, 2004.
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Latest revision as of 19:36, 30 January 2019

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