Publications

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JOURNALS

  1. S. Park, M. Kwon, and D. Kam, “Design of a 77-GHz radar frontend module,”
    Int’l Journal of RF and Microwave Computer-Aided Engineering, under review.
  2. D. Kam, “Optimization of flip-chip transitions for 60-GHz packages,”
    IET Electronics Letters, under review.
  3. M. Kim and D. Kam, “A wideband and compact EBG structure with a circular defected ground structure,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, to be published.
  4. D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814.
  5. D. Kam and J. Kim, “Foreword: special section on through silicon vias,”
    IEEE Trans. Components, Packaging and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153.
  6. A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd, “A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications,”
    IEEE J. Solid-State Circuits, vol. 46, no. 5, May 2011, pp. 1059-1075.
  7. A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd, “Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited),”
    IEEE Communications Magazine, vol. 49, no. 4, Apr. 2011, pp. 120-131.
  8. D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd, “LTCC packages with embedded phased-array antennas for 60-GHz communications,”
    IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144.
  9. A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd, “A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications,”
    IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773.
  10. J. Shim, D. Kam, J. Kwon, and J. Kim, “Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure,”
    IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577.
  11. D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu, “Is 25 Gb/s on-board signaling viable? (invited)”
    IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344.
  12. G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim, “Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis,”
    IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972.
  13. D. Kam and J. Kim, “40-Gb/s package design using wire-bonded plastic ball grid array,”
    IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266.
  14. D. Kam and J. Kim, “Multiport measurement method using a two-port network analyzer with remaining ports unterminated,”
    IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696.
  15. J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
    IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190.
  16. J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,”
    IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559.
  17. D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim, “Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array,”
    IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219.
  18. J. Kim, D. Kam, P. Jun, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce electromagnetic interference,”
    IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920.
  19. H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
    IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173.
  20. D. Kam, H. Lee, and J. Kim, “Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission,”
    IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596.
  21. D. Kam, H. Lee, J. Kim, and J. Kim, “A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise,”
    IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413.
  22. W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim, “RF interconnect for multi-Gbit/s board-level clock distribution,”
    IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407.


CONFERENCES

  1. D. Kam, “전자파 재료의 물성 측정 방법 (Invited),”
    EMC Korea, Oct. 2013.
  2. D. Kam, “Advanced packaging technologies for millimeter-wave applications,”
    제13회 RF집적회로 기술 Workshop, Sep. 2013.
  3. D. Kam, “77 GHz 대역 차량용 레이더를 위한 안테나 내장 송수신 모듈 개발 (Invited),”
    한국전자파학회 하계종합학술대회, Aug. 2013.
  4. X. Gu, D. Kam, D. Liu, M. Piz, A. Valdes-Garcia, A. Natarajan, C. Baks, B. Sadhu, S. Reynolds, “Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications,”
    Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 2013.
  5. D. Kam, “60 GHz 통신을 위한 플라스틱 패키지 개발 사례 (Invited),”
    마이크로전자및패키징학회, Nov. 2012.
  6. D. Kam, “Gbps chip/package/PCB full link SI 시뮬레이션 (Invited),”
    EMC Korea, Aug. 2012.
  7. D. Kam, “Development of organic packages with embedded phased-array antennas for 60-GHz communications (Invited),”
    2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC), Seoul, Korea, May 2012.
  8. D. Kam, “Phased-array transceiver chipsets for 60-GHz communications (Invited),” 한국반도체학술대회, Feb. 2012.
  9. D. Kam, “Package design for 60-GHz wireless chipsets (Invited),”
    한국전자파학회 종합학술대회, Nov. 2011.
  10. D. Kam, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems (Invited Tutorial),”
    International Microwave Symposium (IMS), Baltimore, MD, June 2011.
  11. D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd, “Low-cost antenna-in-package solutions for 60-GHz phased-array systems,”
    IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Austin, TX, Oct. 2010.
  12. D. Kam, "Low-cost antenna-in-package development for mm-Wave applications (Invited Tutorial),"
    IEEE Compound Semiconductor IC Symposium (CSICS), Monterey, CA, Oct. 2010.
  13. A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, B. Floyd, D. Kam, and D. Liu, "A 16-element phased-array transmitter IC and package for 60GHz communications (Invited Tutorial),"
    International Microwave Symposium (IMS), Anaheim, CA, May 2010.
  14. S. Reynolds, A. Natarajan, M. Tsai, S. Nicolson, J. Zhan, D. Liu, D. Kam, O. Huang, A. Valdes-Garcia, B. Floyd, “A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS,”
    Radio-Frequency Integrated Circuit Symposium (RFIC), Anaheim, CA, May 2010.
  15. B. Floyd, A. Valdes-Garcia, A. Natarajan, S. Reynolds, D. Liu, D. Kam, J. Zhan, J. Lai, P. Chen, M. Tsai, S. Nicolson, H. Chen, O. Huang, “Silicon millimeter-wave radios for 60 GHz applications (Invited),”
    Int’l Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), Hsinchu, Taiwan, Apr. 2010.
  16. J. Kash, P. Pepeljugoski, F. Doany, C. Schow, D. Kuchta, L. Schares, R. Budd, F. Libsch, R. Dangel, F. Horst, B. Offrein, Y. Vlasov, W. Green, F. Xia, C. Baks, Y. Kwark, D. Kam, and M. Ritter, “Communication technologies for exascale systems (Invited),”
    SPIE Photonics West, San Jose, CA, Jan. 2009.
  17. M. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, “The viability of 25 Gb/s onboard signaling,”
    Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2008.
  18. D. Kam, T. Beukema, Y. Kwark, L. Shan, X. Gu, and M. Ritter, “Multi-level signaling in high-density, high-speed electrical links,”
    IEC DesignCon 2008, Santa Clara, CA, Feb. 2008 (Best Paper Award).
  19. P. Pepeljugoski, M. Ritter, J. Kash, F. Doany, C. Schow, Y. Kwark, L. Shan, D. Kam, X. Gu, and C. Baks, “Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond (Invited),”
    SPIE Photonics West, San Jose, CA, Jan. 2008.
  20. D. Kam and J. Kim, “Discontinuity cancellation to boost package bandwidth up to material’s limitation,”
    Intl. Symposium on Microelectronics (IMAPS), San Jose, CA, Nov. 2007.
  21. E. Song, J. Cho, D. Kam, and J. Kim, “Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization,”
    Data-dependent jitter estimation using single pulse analysis method,” IEEE International Symposium on Electromagnetic Compatibility (EMCS), Honolulu, HI, July 2007.
  22. E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling,”
    IEEE Electronics System-Integration Technology Conference (ISTC), Dresden, Germany, Sep. 2006.
  23. G. Kim, D. Kam, and J. Kim, “TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Portland, OR, Aug. 2006.
  24. D. Kam, J. Yu, H. Choi, K. Bae, J. Kim, D. Jeong, C. Lee, and J. Kim, “High speed and low noise packaging design methodologies for 40-Gbps SerDes channel with PBGA type package,”
    Progress in Electromagnetics Research Symposium (PIERS), Cambridge, MA, Mar. 2006.
  25. E. Song, J. Lee, J. Kim, D. Kam, C. Ryu, and J. Kim, “Data-dependent jitter estimation using single pulse analysis method,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2005.
  26. J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan, “Near field and far field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications,”
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Austin, TX, Oct. 2005.
  27. H. Park, H. Kim, D. Kam, and J. Kim, “Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design,”
    Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, May 2005.
  28. G. Kim, D. Kam, D. Chung, and J. Kim, “Chip-package co-design of power distribution network for system-in-package applications,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2004.
  29. J. Kim, D. Kam, and J. Kim, “Spread spectrum clock generator with delay cell array to reduce the EMI from a high-speed digital system,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Santa Clara, CA, Aug. 2004.
  30. J. Shim, D. Kam, J. Kwon, H. Choi, and J. Kim, “Circuital approach to evaluate shielding effectiveness of rectangular enclosures with apertures on multiple sides,”
    International Symposium on Electromagnetic Compatibility (EMC-Europe), Eindhoven, The Netherlands, Sep. 2004.
  31. H. Lee, Y. Hong, D. Kam, and J. Kim, “Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole,”
    IEEE Workshop on Signal Propagation on Interconnects (SPI), Heidelberg, Germany, May 2004.
  32. D. Kam, J. Kim, P. Jun, and J. Kim, “Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Boston, MA, Aug. 2003.
  33. D. Kam, S. Ahn, S. Baek, B. Park, M. Sung, and J. Kim, “A novel twisted differential line for high-speed on-chip interconnections with reduced crosstalk,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
  34. S. Baek, B. Park, D. Kam, and J. Kim, “Over GHz frequency model of commercial 2-mm hard metric connector using on-board calibration standards,”
    Electronics Packaging Technology Conference (EPTC), Singapore, Dec. 2002.
  35. D. Kam and J. Kim, “A novel twisted differential line on PCB: crosstalk model and its application to high-speed interconnect circuit design,”
    IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), Monterey, CA, Oct. 2002.
  36. D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “Enhanced immunity against crosstalk and EMI using GHz twisted differential line structure on PCB,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
  37. S. Baek, D. Kam, B. Park, J. Kim, J. Byun, and C. Choi, “Increased radiated emission and impedance change by edge placement of high-speed differential lines on printed circuit board,”
    IEEE International Symposium on Electromagnetic Compatibility (EMCS), Minneapolis, MN, Aug. 2002.
  38. D. Kam, H. Lee, S. Baek, B. Park, and J. Kim, “GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises,”
    Electronic Components and Technology Conference (ECTC), San Diego, CA, May 2002.
  39. H. Lee, B. Park, D. Kam, and J. Kim, “Unit-cell modeling of high-speed interconnect with adjacent metal-filled via array using FDTD method,”
    IEEE Workshop on Signal Propagation on Interconnects (SPI), Pisa, Italy, May 2002.