Publications

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  • "Organic packages with embedded phased-array antennas for 60-GHz wireless chipsets"
by D. Kam, D. Liu, A. Natarajan, S. Reynolds, and B. Floyd
IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 1, no. 11, Nov. 2011, pp. 1806-1814
  • "Foreword: special section on through silicon vias"
by D. Kam and J. Kim
IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 1, no. 2, Feb. 2011, pp. 152-153
  • "A fully-integrated 16-element phased-array receiver in SiGe BiCMOS for 60-GHz communications"
by A. Natarajan, S. Reynolds, M. Tsai, S. Nicolson, J. Zhan, D. Kam, D. Liu, O. Huang, A. Valdes-Garcia, and B. Floyd
IEEE J. Solid-State Circuits, Vol. 46, No. 5, May 2011, pp. 1059-1075
  • "Single-element and phased-array transceiver chipsets for 60-GHz Gb/s communications (invited)"
by A. Valdes-Garcia, S. Reynolds, J. Lai, A. Natarajan, O. Huang, S. Nicolson, P. Chen, M. Tsai, J. Zhan, D. Kam, D. Liu, and B. Floyd
IEEE Communications Magazine, Vol. 49, No. 4, Apr. 2011, pp. 120-131
  • "LTCC packages with embedded phased-array antennas for 60-GHz communications"
by D. Kam, D. Liu, A. Natarajan, S. Reynolds, H. Chen, and B. Floyd
IEEE Microwave and Wireless Components Letters, Vol. 21, No. 3, Mar. 2011, pp. 142-144
  • "A fully integrated 16-element phased-array transmitter in SiGe BiCMOS for 60GHz communications"
by A. Valdes-Garcia, S. Nicolson, J. Lai, A. Natarajan, P. Chen, S. Reynolds, J. Zhan, D. Kam, D. Liu, and B. Floyd
IEEE J. Solid-State Circuits, Vol. 45, No. 12, Dec. 2010, pp. 2757-2773
  • "Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure"
by J. Shim, D. Kam, J. Kwon, and J. Kim
IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 3, Aug. 2010, pp. 566-577
  • "Is 25 Gb/s on-board signaling viable? (invited)"
by D. Kam, M. Ritter, T. Beukema, J. Bulzacchelli, P. Pepeljugoski, Y. Kwark, L. Shan, X. Gu, C. Baks, R. John, G. Hougham, C. Schuster, R. Rimolo-Donadio, and B. Wu
IEEE Trans. Advanced Packaging, Vol. 32 No. 2, May 2009, pp. 328-344
  • "Modeling of eye-diagram distortion and data-dependent jitter in meander delay lines on high-speed printed circuit boards (PCBs) based on a time-domain even-mode and odd-mode analysis"
by G. Kim, D. Kam, S. Lee, J. Kim, M. Ha, K. Koo, J. Pak, and J. Kim
IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 8, Aug. 2008, pp. 1962-1972
  • "40-Gb/s package design using wire-bonded plastic ball grid array"
by D. Kam and J. Kim
IEEE Trans. Advanced Packaging, Vol. 31, No. 2, May 2008, pp. 258-266
  • "Multiport measurement method using a two-port network analyzer with remaining ports unterminated"
by D. Kam and J. Kim
IEEE Microwave and Wireless Components Letters, Vol. 17, No. 9, Sep. 2007, pp. 694-696
  • "Near-field and far-field analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications"
by J. Choi, D. Kam, D. Chung, K. Srinivasan, V. Govind, J. Kim, and M. Swaminathan
IEEE Trans. Advanced Packaging, Vol. 30, No. 2, May 2007, pp. 180-190
  • "Modeling and measurement of simultaneous switching noise coupling through signal via transition"
by J. Park, H. Kim, Y. Jeong, J. Kim, J. Pak, D. Kam, and J. Kim
IEEE Trans. Advanced Packaging, Vol. 29, No. 3, Aug. 2006, pp. 548-559
  • "Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array"
by D. Kam, J. Yu, H. Choi, K. Bae, C. Lee, and J. Kim
IEEE Design & Test of Computers, Vol. 23, No. 3, May-June 2006, pp. 212-219
  • "Spread spectrum clock generator with delay cell array to reduce electromagnetic interference"
by J. Kim, D. Kam, P. Jun, and J. Kim
IEEE Trans. Electromagnetic Compatibility, Vol. 47, No. 4, Nov. 2005, pp. 908-920
  • "Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole"
by H. Lee, Y. Hong, D. Kam, and J. Kim
IEEE Trans. Advanced Packaging, Vol. 28, No. 2, May 2005, pp. 168-173
  • "Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission"
by D. Kam, H. Lee, and J. Kim
IEEE Trans. Advanced Packaging, Vol. 27, No. 4, Nov. 2004, pp. 590-596
  • "A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise"
by D. Kam, H. Lee, J. Kim, and J. Kim
IEEE Microwave and Wireless Components Letters, Vol. 13, No. 9, Sep. 2003, pp. 411-413
  • "RF interconnect for multi-Gbit/s board-level clock distribution"
by W. Ryu, J. Lee, H. Kim, S. Ahn, N. Kim, B. Choi, D. Kam, and J. Kim
IEEE Trans. Advanced Packaging, Vol. 23, No. 3, Aug. 2000, pp. 398-407